Till now, most companies use laser beam printing to etch out exact designs, but the cost of technology is higher compared to 
HP’s technique. You can attach the mould in a matter of minutes and start mass production. A common problem, though, while packing in tones of circuitry so close, is the problem of over-heating. A problem, companies like Dell and Sony are familiar with, as Dell laptops started exploding due overheating of the batteries, causing a wide scale withdrawal of the entire shipment of nearly 4 million units.
Th at is where IBM’s recent invention can come in handy. The blue-eyed boy of the IT world has been inspired by the natural process of building seashells or tooth enamel to make self assembling chips. This technique makes trillions of holes of vacuum that act as super insulators, enabling nano-scale wires to be jammed next to each other without any fear from excess heat. This technology reduces energy consumption by 15%.
Explains Dan Edelstein, IBM’s chief scientist, “By moving self assembly from the lab to the fab, we are able to make chips that are smaller, faster and consume less power than existing materials and design architecture allow.” Clearly, while on a company level, the scientists are fighting for the upper hand, the chip industry on a whole is going through a major upheaval. Speed of innovation will be the critical factor to decide the winners of the future...
HP’s technique. You can attach the mould in a matter of minutes and start mass production. A common problem, though, while packing in tones of circuitry so close, is the problem of over-heating. A problem, companies like Dell and Sony are familiar with, as Dell laptops started exploding due overheating of the batteries, causing a wide scale withdrawal of the entire shipment of nearly 4 million units.Th at is where IBM’s recent invention can come in handy. The blue-eyed boy of the IT world has been inspired by the natural process of building seashells or tooth enamel to make self assembling chips. This technique makes trillions of holes of vacuum that act as super insulators, enabling nano-scale wires to be jammed next to each other without any fear from excess heat. This technology reduces energy consumption by 15%.
Explains Dan Edelstein, IBM’s chief scientist, “By moving self assembly from the lab to the fab, we are able to make chips that are smaller, faster and consume less power than existing materials and design architecture allow.” Clearly, while on a company level, the scientists are fighting for the upper hand, the chip industry on a whole is going through a major upheaval. Speed of innovation will be the critical factor to decide the winners of the future...
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Source: IIPM Editorial, 2006
An IIPM and Management Guru Prof. Arindam Chaudhuri's Initiative
Read more:-
Source: IIPM Editorial, 2006
An IIPM and Management Guru Prof. Arindam Chaudhuri's Initiative
Read more:-
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